The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 1987
Filed:
Dec. 24, 1985
Applicant:
Inventors:
Yasuhisa Saito, Osaka, JP;
Hisao Takagishi, Kyoto, JP;
Katsuya Watanabe, Osaka, JP;
Kohichi Okuno, Osaka, JP;
Junichi Kenmei, Hyogo, JP;
Kunimasa Kamio, Osaka, JP;
Assignee:
Sumitomo Chemical Company, Limited, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ;
U.S. Cl.
CPC ...
525504 ; 525423 ; 528 99 ; 528108 ; 528109 ; 528113 ; 528117 ; 528322 ;
Abstract
A thermosettable heat-resistant resin composition containing (A) an amino group-terminated imide compound produced by imidating an aromatic diamine with an aromatic tetracarboxylic anhydride at a diamine:anhydride molar ratio of from 1.2:1 to 4:1, and (B) an epoxy resin having at least two epoxy groups, the molar ratio of the amino group of the imide compound to the epoxy group of the epoxy resin being 1:1.6 to 1:2.6.