The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1987
Filed:
Nov. 01, 1985
Wolfgang Ehrfeld, Karlsruhe, DE;
Peter Hagmann, Eggenstein-Leopoldshafen, DE;
Dietrich Munchmeyer, Stutensee-Spock, DE;
Erwin W Becker, Karlsruhe, DE;
Kernforschungszentrum Karlsruhe GmbH, Karlsruhe, DE;
Abstract
Method for producing a plurality of deformable connecting elements for electrically joining microelectronic components. The method includes irradiating with high energy radiation portions of a plate-like member composed of material having a material characteristic which is changed by such high energy radiation, each portion having dimensions corresponding to those of a connecting element; utilizing the changed material characteristic of the material of the irradiated portions to remove such material from the irradiated portions to produce a plate-like mold containing a plurality of mold structures each defining a shape corresponding to a connecting element at a given location of said member, each such mold structure having lateral dimensions and a height dimension which is a multiple of the smallest lateral dimension; filling the mold structures with metal by electroplating the metal into such mold structures to produce metallic connecting elements; fixing the connecting elements to a microelectronic component; and removing the plate-like mold.