The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 1987

Filed:

Dec. 17, 1985
Applicant:
Inventor:

Clarence K Palmer, Polo, IL (US);

Assignee:

PNC, Inc., Polo, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437211 ; 174 / ; 26427217 ; 264248 ; 264259 ; 264274 ; 357 70 ;
Abstract

A method of making an integrated circuit package comprising an integrated 'chip' within an hermetically sealed housing with external electrical leads extending from the chip terminals, and the product formed by such method. The method involves injection molding of a thermoplastic rim on and in sealed relation to a lead frame prior to locating the chip in the central region of the frame and installing fine wire connections from the chip terminals to the lead fingers. The housing is completed by a solid bottom wall insert sealed in the lower mouth of the rim and a solid top wall cap sealed to the upper mouth of the rim by procedures which involve no flowing of plastic material over or into contact with either (i) the upper surfaces of the lead fingers prior to making the wire connections to such fingers, or (ii) the chip and the wire connectors after they have been associated with the lead frame.


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