The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 1987

Filed:

Jun. 05, 1986
Applicant:
Inventors:

Motomasa Imai, Tokyo, JP;

Mitsuo Harata, Kawasaki, JP;

Takashi Takahashi, Tokyo, JP;

Kazuo Nishijima, Hadano, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D / ;
U.S. Cl.
CPC ...
346 742 ; 346 745 ; 360122 ;
Abstract

A method is disclosed which manufactures a recording head adapted to be moved relative to a recording medium, which is comprised of a conductive substrate and dielectric layer formed on the conductive substrate, to permit data to be recorded on the recording medium with the use of a conductive/magnetic toner on the recording medium. A conductive/magnetic sheet is attached to an insulating substrate of a first size with an adhesive layer therebetween, the first size of the insulating substrate is greater than a second size thereof defined by an insulating substrate of a finally completed recording head. The conductive/magnetic sheet is selectively etched to form an array of slits at a predetermined interval with both ends of the slits located beyond the side edges of an insulating substrate of a finally completed recording head. At one side edge portion of the conductive/magnetic sheet the conductive/magnetic sheet is electroplated to form a plated layer for a bonding pad. Those areas of the conductive/magnetic sheet, plated layer and insulating substrate, which are located beyond the side edge of the insulating substrate of the finally completed recording head, are cut to form a parallel array of electrodes and a bonding pad on one side edge portion of the conductive/magnetic electrodes.


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