The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1987
Filed:
Mar. 13, 1986
Applicant:
Inventor:
George Y Eastman, Lancaster, PA (US);
Assignee:
Thermacore, Inc., Lancaster, PA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 82 ; 357 81 ;
Abstract
A semiconductor circuit construction in which the semiconductor junction is constructed as an integral part of a heat pipe to eliminate the casing which interferes with heat flow. The semiconductor chip material directly forms one wall of the casing of a heat pipe which is constructed as a hollow wafer-like configuration. A special material formed from a mixture of glass and the semiconductor material and which is directly adjacent to the backside of the semiconductor chip is used as the heat pipe wick.