The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 1987

Filed:

Jul. 17, 1986
Applicant:
Inventor:

George Wozniczka, Chicago, IL (US);

Assignee:

Zenith Electronics Corporation, Glenview, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361386 ; 361381 ; 200289 ; 174 / ;
Abstract

A two piece heat sink includes a first elongated mount/support member adapted at a first end for secure mounting on a printed circuit (PC) board and a second finned convector member adapted for secure, intimate coupling to a second end of the first mount/support member. The second convector member has a serrated aperture, or channel, therein and a plurality of fins disposed about its lateral periphery and aligned along the longitudinal axis of the first mount/support member so as to be oriented generally perpendicular to the plane of the PC board. The mount/support member is tapered along its length and its second end is beveled to facilitate its insertion within the second member's aperture to permit the mount/support member to be press fit coupled to the convector member. Press fitting the two heat sink members together causes the serrations within the convector member's aperture to cold flow resulting in intimate and secure coupling between the two heat sink members providing a high degree of mechanical coupling and thermal transfer therebetween. The vertically oriented fins are aligned with the upward flow of air heated by the circuitry on the PC board for efficient thermal dissipation, while the mount/support member provides a mounting surface for an electronic component and allows for minimum PC board mounting area for the heat sink.


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