The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 1987
Filed:
Aug. 01, 1986
Pallab K Chatterjee, Dallas, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A micropackage for providing high density, three dimensional packaging of integrated circuit chips. A chipmount (10) includes a plurality of channels (36) on the bottom surface thereof for holding a corresponding plurality of integrated circuit chips (16). A shallow cavity (34) is formed on the top surface of the chipmount (10) for holding another integrated circuit (14). Metallization interconnections (22) are formed on the top and bottom surfaces of the chipmount (10) and are terminated by solder pads (24, 39). Conductive conduits (26) are formed through the chipmount (10) for providing electrical continuity between an integrated circuit chip (14) mounted on the top side, to other integrated circuit chips (16) mounted on the bottom side of the chipmount. Other conductive conduits (30, 32) and a bridging member (28) insulates intersecting conductive paths (48, 50). The micropackage is fabricated with standard silicon technology.