The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 1987

Filed:

Dec. 12, 1986
Applicant:
Inventors:

David E Hackleman, Monmouth, OR (US);

James G Bearss, Boise, ID (US);

Eldurkar V Bhaskar, Corvallis, OR (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D / ;
U.S. Cl.
CPC ...
3461 / ; 29611 ; 29846 ; 219216 ; 346-11 ;
Abstract

The specification describes thermal ink jet (TIJ) processes and device structures produced thereby wherein either heater resistors or heater resistor-diode combinations are constructed vertically upward from a common supporting substrate. A lower or first metal level conductor pattern provides one part of an X-Y matrix multiplex connection to the resistor/diode components, and a second, upper metal level conductor pattern forms the second part of the X-Y matrix multiplex connection. In this manner, the multiplex drive circuitry for the TIJ printhead resistors/diodes may be fabricated (integrated) directly on the thin film resistor (TFR) printhead substrate. Additionally, the second level metal conductors which overlie the resistive heater and diode elements also serve as a barrier shield to ink corrosion and cavitation wear.


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