The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 1987
Filed:
Dec. 04, 1986
Applicant:
Inventors:
C S Chan, Boise, ID (US);
Robert R Hay, Boise, ID (US);
Assignee:
Hewlett-Packard Company, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01D / ;
U.S. Cl.
CPC ...
3461 / ; 346 75 ;
Abstract
This application discloses a thermal ink jet printhead and method of manufacture featuring an improved all-metal orifice plate and barrier layer assembly. This assembly includes constricted ink flow ports to reduce cavitation damage and smooth contoured convergent ink ejection orifices to prevent 'gulping' of air during an ink ejection process. Both of these features extend the maximum operating frequency, fmax, of the printhead. The nickle barrier layer and the underlying thin film resistor substrate are gold plated and then soldered together to form a good strong solder bond at the substrate-barrier layer interface.