The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 1987

Filed:

Dec. 24, 1986
Applicant:
Inventor:

Masanori Nakatsuka, Itami, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 65 ; 357 68 ; 357 71 ; 357 81 ;
Abstract

A semiconductor apparatus comprises a semiconductor pellet having upper and lower main surfaces, and upper and lower protector plates against thermal stress soldered to the upper and lower main surfaces, respectively, of the semiconductor pellet wherein the whole area of the lower protector plate is larger than the lower main surface but has an inner part smaller than the lower main surface and made thicker than an outer part by being bounded with a step, the inner portion being soldered to the pellet at the lower main surface region, whereby the surface of the outer portion is spaced from the lower main surface by a distance corresponding to the height of the step.


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Nakatsuka, Masanori. (1987). Semiconductor device with solder overflow prevention geometry (U.S. Patent No. 4692788). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4692788

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