The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 1987

Filed:

Apr. 15, 1986
Applicant:
Inventors:

Masayasu Nihei, Hitachi, JP;

Masateru Suwa, Ibaraki, JP;

Mitsuo Chigasaki, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
20419231 ; 20419211 ; 20419212 ; 204298 ;
Abstract

A method for forming a thin film wherein plural targets of different materials are alternately sputtered througth the switching of the electric powers supplied thereto, the particles produced from the sputtering are ionized and thereafter deposited on a substrate. This method provides an alloy thin film, compound thin film or multi-layer thin film of any composition and enhances adhesion among the particles. A sputtering device for practicing this method is also disclosed.


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