The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 1987
Filed:
Mar. 31, 1986
George Wozniczka, Chicago, IL (US);
Zenith Electronics Corporation, Glenview, IL (US);
Abstract
A heat sink positioned on a printed circuit (PC) board includes a generally planar center portion and first and second pluralities of spaced planar ribs extending generally transversely from respective lateral edges of the center portion. The heat sink is adapted for generally perpendicular mounting on the PC board and includes first, second and third mounting tabs respectively extending from the lower edges of the bottom lateral ribs of the first and second pluralities of lateral ribs as well as from the lower edge of the planar center portion. Each mounting tab is adapted for insertion within a respective aperture in the PC board and includes an elongated proximal portion and a distal end portion. The distal end portion of the mounting tab is wider than the proximal portion thereof and includes a pair of cam surfaces, each disposed on a respective lateral edge of the mounting tab and adapted to engage a respective edge portion of the PC board immediately adjacent to the PC board aperture when the distal end portion is rotationally displaced about the elongated proximal portion of the mounting tab resulting in the twisting thereof. Thus, the heat sink is mounted on the PC board in a positive locking manner. Rotation of the mounting tab and further engagement of the cam surfaces thereof with the edges of the PC board aperture provide more intimate heat sink-PC board contact which affords increased thermal transfer, more secure and stable heat sink mounting, and more reliable PC board assembly.