The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 1987
Filed:
Jan. 28, 1983
Applicant:
Inventors:
Gen Murakami, Machida, JP;
Takeshi Gappa, Ohme, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 80 ; 174 / ; 357 74 ; 357 81 ;
Abstract
A semiconductor device comprising a package base whose material is glass epoxy or the like, a plurality of leads which are formed in a manner to extend from the front surface to the rear surface of the package base, a semiconductor element which is fastened to the package base and which is electrically connected to the leads, and a resin which seals, at least, the semiconductor element and electrical connection parts between the element and the leads.