The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 1987
Filed:
Sep. 10, 1986
Yukio Inokuti, Chiba, JP;
Shigeko Ikeda, Chiba, JP;
Toshihiko Funahashi, Chiba, JP;
Yo Ito, Chiba, JP;
Kawasaki Steel Corporation, Kobe, JP;
Abstract
A substrate for print circuit board comprising a steel sheet, a forsterite film layer formed on at least one surface of the steel sheet, and an insulating film layer formed on the forsterite film layer by baking a coating solution mainly consisting of a phosphate and colloidal silica. A print circuit board having a conductive pattern on the insulating film layer of the substrate for print circuit board, and methods of manufacturing the substrate and the print circuit board. One of typical methods of manufacturing the substrate for print circuit board comprises steps of applying an annealing separator mainly consisting of MgO on the steel sheet and annealing it to form a forsterite film layer, applying and baking a coating solution mainly consisting of the phosphate and colloidal silica onto the forsterite film layer to form an insulating film layer. The print circuit board is obtained by bonding the conductive pattern to the insulating film layer and annealing at a temperature range of not lower than 300.degree. C. but lower than 1,050.degree. C.