The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 1987

Filed:

Oct. 23, 1985
Applicant:
Inventors:

Thomas C Clarke, Morgan Hill, CA (US);

Neng H Lu, Endwell, NY (US);

Yaffa Tomkiewicz, Scarsdale, NY (US);

Ho M Tong, Yorktown Heights, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; B05D / ; B32B / ; D04H / ;
U.S. Cl.
CPC ...
427299 ; 156181 ; 427386 ; 4273898 ; 4274301 ;
Abstract

A method is disclosed for the manufacture of void-free prepregs formed by the impregnation of a reinforcing cloth (e.g. glass fiber cloth) with a solution of a thermosetting resin (e.g. epoxy resin). In the method, the reinforcing cloth is first prewetted with a liquid medium containing a solvent for the resin which has a viscosity less than that of the solution of thermosetting resin. The prewetted cloth is impregnated with a solution of the resin and then heated to remove the solvent and cure the resin. The prepregs are used in the manufacture of printed circuit boards.


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