Selective plating apparatus

Abstract

An apparatus for plating interior surfaces of electrical terminals that are attached to a carrier strip comprises a mandrel having first and second portions, the first portion being comprised of dielectric members which are mounted for rotation on a shaft as strip fed terminals are continuously fed to the first portion; wrapped against it and exited therefrom; and a second conductive portion mounted in a stationary portion on the same shaft. First dielectric portion includes a plurality of nozzles distributed about its axis of rotation. A plurality of anode members are mounted within the nozzles, the anode members being movable into and out of interiors of terminals that are wrapped against the dielectric portion. A conduit supplies plating solution under pressure through the nozzles and upon anode members. A source of electrical potential supplies electrical current flow from anode members through plating solution and into interiors of terminals thus forming a plurality of plating cells about the dielectric portion. The apparatus includes means for assuring electrical engagement between the anode assemblies and the conductive portion so that an essentially uniform current is suppled to each plating cell. The apparatus further includes camming means which cooperates with a camming engagement member on each anode assembly to ensure retraction of each assembly from its corresponding terminal.