The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 1987
Filed:
Sep. 27, 1983
Applicant:
Inventors:
Hidehiko Akasaki, Aizuwakamatsu, JP;
Kiyoshi Miyasaka, Yokohama, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 80 ; 357 74 ; 361386 ; 365226 ;
Abstract
A modular semiconductor device for use as a memory or used in logic circuit electronic equipment, includes a plurality of IC chips mounted on one or both sides of a printed circuit substrate. The IC chips are grouped into at least two groups which are selectively operated. The IC chips in one group are arranged alternately with the IC chips in the order group to provide a substantially uniform temperature distribution, over the substrate, of heat build-up in the substrate due to activation of the IC chips.