The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 1987

Filed:

Sep. 10, 1986
Applicant:
Inventors:

Toshio Kawabata, Uji, JP;

Kunisaburo Tomono, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F / ; H01F / ;
U.S. Cl.
CPC ...
336200 ; 336225 ;
Abstract

A multi-layer chip coil which comprises a stack of intermediate laminas of magnetizeable material having a through-hole defined therein so as to extend completely through the thickness thereof, first and second patterned electric conductors formed on the opposite surfaces of each of the intermediate laminas, respectively, and an electroconductive element extending through the through-hole so as to connect the first and second conductors together. The intermediate laminas are stacked one above the other with the first and second conductors in one intermediate lamina partially overlapping in contact with the second conductor in the neighboring intermediate lamina immediately thereabove and the first conductor in the neighboring intermediate lamina immediately therebelow, respectively, whereby the first and second conductors in all of the intermediate laminas, which are connected in series with each other through the respective conductive element, are connected in series with each other.


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