The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 1987

Filed:

Mar. 26, 1986
Applicant:
Inventors:

Akira Miyamoto, Hiratsuka, JP;

Toshiaki Nishimura, Kanagawa, JP;

Yoshitaka Yamagishi, Hiratsuka, JP;

Yasumitsu Higuchi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ;
U.S. Cl.
CPC ...
528247 ; 525398 ; 525400 ; 528232 ;
Abstract

A highly reactive aromatic hydrocarbon-formaldehyde resin having a diarlymethane content of not more than 5% by weight, essentially containing reactive groups of any one of CH.sub.2 OH, CH.sub.2 OCH.sub.3 and CH.sub.2 OCH.sub.2 OCH.sub.3 at both molecular terminals and having a xylenol value of at least 15 mol/kg as an index of reactivity with a compound having active hydrogen atoms is prepared by reacting an aromatic hydrocarbon such as xylene, mesitylene or naphthalene with formaldehyde at a molar ratio of the formaldehyde to the aromatic hydrocarbon of 2.0 to 5.0, a sulfuric acid concentration of 15 to 35% by weight in an aqueous layer and a reaction temperature of 80.degree. to 110.degree. C. while controlling a formaldehyde conversion within a range of 50 to 70% by mole over the range 4 to 8 hours. By reaction of the aromatic hydrocarbon-formaldehyde resin with the compound having reactive hydrogen atoms such as phenols and carboxylic acids, a modified aromatic hydrocarbon resin capable of giving a cured resin having a high mechanical strength and a high heat resistance can be obtained.


Find Patent Forward Citations

Loading…