The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 1987
Filed:
Jun. 07, 1985
Vincent P Barkley, Arlington, VA (US);
William J Siegel, Silver Spring, MD (US);
PACE, Incorporated, Laurel, MD (US);
Abstract
Heater device suitable for heating a fluid such as air to be contacted with a plurality of terminals of a modular electronic component to facilitate attachment of the component to a printed circuit board or removal therefrom. The device comprises two heat exchange elements having a stainless steel etched foil heater sandwiched therebetween. Each heat exchange element is approximately square in configuration, and has a passageway extending from an outer peripheral point of each element about a central axis parallel to the four sides of each element toward the center. The heat exchange elements may be connected for serial flow whereby air to be heated passes along the passageway of one element and then enters the second heat exchange element and passes through that element and exits therefrom, or for parallel flow whereby a first stream of air to be heated passes through one of the elements and a second stream of air to be heated passes through the second heat exchange element. In a preferred embodiment, the heated device has two plenums one adjacent to each heat exchange element so that air contained in each plenum is at least partially heated by the associated heat exchange element. In addition, the air in each plenum at least partially insulates the heat exchange elements from the exterior of the device, thereby preventing undue increase in temperature in the immediate vicinity of the device.