The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 1987
Filed:
Feb. 13, 1985
John T Siemon, Indiana Township, Allegheny County, PA (US);
Rajender K Sadhir, Plum Boro, PA (US);
Westinghouse Electric Corp., Pittsburgh, PA (US);
Abstract
Disclosed is a method of coating a fibrous or filamentous organic polymeric substrate by forming a liquid which comprises an organic compound having a vapor pressure of less than about 400 mm at room temperature, applying the liquid to the substrate, evaporating any solvent which is present, and exposing the liquid to an ionized non-polymerizing inorganic gas. Also disclosed is a coated substrate comprising a fibrous or filamentous substrate made of an organic polymeric material and a saturated aliphatic hydrocarbon coating on the substrate polymerized and chemically bonded to the polymeric material. A laminate is made by impregnating the treated substrate with an organic impregnating resin, heating the impregnated treated substrate to evaporate any solvent and to partially cure the organic impregnating resin, forming a prepreg, forming a stack of a plurality of prepregs, and heating the stack under pressure to fully cure the impregnating resin. Copper can be placed at one or both ends of the stack prior to fully curing the impregnating resin in order to form a circuit board.