The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 1987
Filed:
Jan. 07, 1986
Applicant:
Inventors:
Assignee:
Kabushiki Kaisha Kobe Seiko Sho, Kobe, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
420481 ; 420471 ; 420472 ; 420473 ; 420479 ;
Abstract
A lead material for ceramic package ICs which comprises Ni 1.0-5.0 wt %, Co 0.2-1.0 wt %, Si 0.2-1.5 wt %, Zn 0.1-5.0 wt %, Cr 0.001-0.1 wt %, and Mn 0.02-1.0 wt %, with the remainder being Cu and inevitable impurities. It does not cause cracking to the ceramic substrate in the cooling step after silver soldering at 800.degree. to 950.degree. C., even though its coefficient of thermal expansion differs from that of ceramics. Moreover, it retains its high strength and conductivity after brazing.