The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 1987

Filed:

Dec. 04, 1985
Applicant:
Inventors:

Haruo Tominaga, Sakura, JP;

Teruyuki Takayama, Chiba, JP;

Yoshio Ogura, Chiba, JP;

Tetsuo Yamaguchi, Yokohama, JP;

Assignee:

Fujikura Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
428610 ; 428675 ; 428658 ; 428677 ; 428941 ; 4273839 ; 427406 ; 219 / ; 1741 / ;
Abstract

An electrode wire for wire electric discharge machining a workpiece at high speed and high accuracy and a process for preparing the same are provided. The electrode wire comprises a core wire made of a copper clad steel wire, 10 to 70% of the sectional area of the copper clad steel wire being occupied by copper, and a copper-zinc alloy layer covering the core wire. The copper-zinc alloy layer is prepared by coating the core wire with zinc by electroplating or hot galvanizing, followed by heating to disperse copper in the zinc layer to convert the same into a copper-zinc alloy layer wherein the concentration of zinc is increased gradually along the radially outward direction. The preferable thickness of the copper-zinc alloy layer ranges from 0.1 to 15 microns and the average concentration of zinc in the copper-zinc alloy layer is preferably less than 50% by weight but not less than 10% by weight.


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