The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 1987

Filed:

Mar. 07, 1985
Applicant:
Inventors:

Katsuhiro Abe, Mie, JP;

Yoshinobu Kobayashi, Mie, JP;

Mitsushige Baba, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ;
U.S. Cl.
CPC ...
524227 ; 524228 ; 524229 ; 524288 ;
Abstract

A composition comprising an amorphous resin (excluding polyphenylene ether) and a specific diamide compound of the formula ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 are defined in the specification. The moldability of the amorphous resin is improved without reducing its heat resistance.


Find Patent Forward Citations

Abe, Katsuhiro. (1987). Thermoplastic resin composition having improved moldability comprising (U.S. Patent No. 4684684). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4684684

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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