The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 1987
Filed:
Aug. 05, 1985
Michael Langenwalter, Stockdorf/Gauting, DE;
Karl H Moehrmann, Munich, DE;
Herbert Prussas, Reichertshausen, DE;
Lothar Spaeter, Annweiler am Trifels, DE;
Siemens Aktiengesellschaft, Berlin and Munich, DE;
Abstract
A common housing for two semi-conductor bodies is provided, comprising a front and back section for two spatially separate semi-conductor bodies attached in the housing interior but preferably connected in electrically conductive fashion to one another, whereby the housing surface preferably composed entirely of metal is cooled during operation by a flowable coolant, preferably cooling air. The front, first semi-conductor body is attached in the front section thereof and the back, second semi-conductor body is attached in the back section thereof, the maximum operating temperature of the back semi-conductor body being higher than the maximum operating temperature of the front semi-conductor body, at least at times. The thermal resistance between the front semi-conductor body and a front thermally conductive cooling surface as well as the thermal resistance between the back semi-conductor body and a back thermally conductive cooling surface differing from the front cooling surface, being respectively lower than both the thermal resistance in the housing interior between the two semi-conductor bodies as well as the thermal resistance between the front and the back cooling surface. During operation, the coolant first flows past the front cooling surface and subsequently flows past the back cooling surface.