The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 1987
Filed:
Mar. 06, 1986
Paul J Sokolovsky, Sunnyvale, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A machine for applying an adhesive pad to the ends of semiconductor device packages includes a punch assembly, a tape feed assembly, and a package feed assembly. The tape is incrementally fed to the punch assembly where semiconductor packages are individually brought into alignment. The punch assembly first shears an adhesive pad from the tape and thereafter applies the pad to the package. The punch member of the punch assembly includes a resilient tip which assures that the tape is securely attached to the package and helps prevent damage to the package. Semiconductor device packages having such taped ends are less likely to be damaged in subsequent processing and handling.