Jig for supporting array of articles to be soldered and device for

Abstract

A jig for arraying and supporting a multiplicity of articles to be soldered wherein pairs of lower supporting wires are extended for supporting the lower side of respective articles between frame members adapted to be secured to a conveyor holder of a soldering line, pairs of upper supporting wires are arranged above the lower supporting wires in parallel with the latter along both side surfaces of respective articles, one end of each of the upper supporting wires being passed loosely through a hole formed on the frame member, and a gate member supporting the other ends of said upper supporting wires is provided movably up and down with respect to the frame member. A device for transferring articles to be soldered wherein a tiltable plate is rockably supported at its mid portion by a supporting bed through a support shaft for such a rocking motion so that one end thereof is lowered while the other end is raised and vice versa, a package fixing device is provided on the upper side of one end of the tiltable plate and adapted for fixing packages accommodating arrays of a multiplicity of articles to be soldered, and a mount guide member provided on the upper surface of the other end of the tiltable plate and provided with a multiplicity of guide grooves formed therein in alignment with the packages.