The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 1987
Filed:
Sep. 18, 1985
Toshiharu Konishi, Osaka, JP;
Yukio Shimizu, Osaka, JP;
Takahumi Sakuramoto, Osaka, JP;
Tsuyoshi Morishita, Hiroshima, JP;
Shigemi Osaki, Hiroshima, JP;
Abstract
A method for fixing an alloy powder molding at sintering composition by placing an alloy powder molding formed by rolling a mixture of an alloy powder and a synthetic resin-based pressure-sensitive adhesive composition on a metal base material by interposing a composition between the molding and the base material until the molding is sintered, in the case that the alloy powder molding is placed on the metal base material and sintered after keeping at 150.degree. to 400.degree. C. for at least 5 minutes under a non-oxidizing atmosphere, the composition comprising as a main component an acrylic copolymer which comprises about 80 to 99.5% by weight of alkyl (meth)acrylate having an average carbon atom number of 2 to 12 in the alkyl moiety and about 20 to 0.5% by weight of a polymerizable monomer having a functional group in the molecule or a mixture of 100 parts by weight of the copolymer and about 0.1 to 100 parts by weight of a resin which gives adhesive property, the composition having a 10 second shear creep compliance of about 0.1 to 30.times.10.sup.-6 cm.sup.2 /dyne at room temperature and at least about 30% by weight of non-volatile materials when heated at 300.degree. C. for 80 minutes under a non-oxidizing atmosphere.