The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 1987
Filed:
Oct. 30, 1985
Applicant:
Inventors:
Assignees:
Dai Nippon Toryo Co., Ltd., Osaka, JP;
Tokai Kogyo Co., Ltd., Aichi, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29B / ;
U.S. Cl.
CPC ...
264 24 ; 264 25 ; 264512 ; 264104 ; 264105 ; 264118 ; 264131 ; 264255 ; 2643287 ; 264338 ; 264D / ; 427 25 ;
Abstract
A molding process for producing a molded plastic product with a resin coating layer formed on its surface, which comprises electrostatically coating a powdery resin composition on the inner surface of a mold, filling and molding a plastic material in the mold to form a molded plastic product, and plasticizing, under compression, said powdery resin composition by the heat of the filled plastic material and/or by the heat for molding the filled plastic material, to form a resin coating layer securely bonded to the surface of the molded plastic product by anchor effect.