The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 1987
Filed:
Jun. 05, 1986
Kenshi Kondo, Tokyo, JP;
Nihon Den-Netsu Keiki Co., Ltd., Tokyo, JP;
Abstract
A vapor phase soldering apparatus for soldering printed circuit boards, including a vessel for containing a heat transfer liquid, partition plates provided within the vessel for dividing the inside space of the vessel into inner and outer chambers which are in fluid communication with each other at upper and lower portions of the partition plates, a heater provided in the inner chamber to heat and to vaporize the heat transfer liquid in the inner chamber, a cooler provided within the outer chamber to cool and to condense vapors of the heat transfer liquid in the outer chamber, and a conveyor for conveying printed circuit boards through the vessel, whereby the printed circuit boards are soldered in the inner chamber by contact with the vapors of said heat transfer liquid, and the vapors escaped from the inner chamber to the outer chamber are condensed in the outer chamber and recycled to the inner chamber.