The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 1987
Filed:
Sep. 16, 1986
Kenshi Kondo, Tokyo, JP;
Nihon Den-Netsu Keiki Co., Ltd., Tokyo, JP;
Abstract
A vapor phase bonding apparatus wherein articles to be bonded are heated with hot vapors of a heat transfer liquid so that a bonding agent such as a solder provided between the articles to be bonded is melted to effect the bonding. The apparatus includes a vessel for containing the heat transfer liquid, a heater for vaporizing the heat transfer liquid, inlet and outlet port means provided in the vessel to allow the passage of articles to be bonded therethrough, conveying means to convey the articles through the inside of the vessel via inlet and outlet port means, closure means for opening and closing the inlet and outlet port means, and cooling means provided on the closure means for condensing vapors of the heat transfer liquid.