The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 1987
Filed:
Nov. 06, 1985
Applicant:
Inventor:
Hiroshi Yamanaka, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
2191 / ; 2191 / ; 2191 / ;
Abstract
A method of laser trimming in a semiconductor wafer, and more particularly, a method of laser trimming for disconnecting programmable links by use of a laser beam which links are provided within a multiplicity of semiconductor integrated circuit elements formed in the semiconductor wafer.