The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 1987

Filed:

Oct. 31, 1985
Applicant:
Inventors:

Keith S Pennington, Somers, NY (US);

Ali Afzali-Ardakani, White Plains, NY (US);

Krishna G Sachdev, Wappingers Falls, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41M / ;
U.S. Cl.
CPC ...
428213 ; 219216 ; 400118 ; 400119 ; 400120 ; 400241 ; 4002411 ; 428209 ; 428212 ; 428323 ; 428333 ; 428409 ; 428412 ; 428421 ; 428422 ; 428469 ; 428484 ; 428688 ; 428696 ; 428913 ; 428914 ;
Abstract

An improved resistive ribbon for resistive thermal transfer printing is described in which the resistive layer of the ribbon has enhanced thermal and mechanical properties. The ribbon is a multi-layer ribbon including a resistive layer, an electrical current return layer, and an ink layer. The resistive layer has an additive therein which phase separates and concentrates in a thin surface region near the interface of the resistive layer and the current return layer. This thin region has superior thermal and mechanical properties, and protects the remainder of the resistive layer during the printing operation, without adversely affecting the mechanical, electrical, and thermal properties of the overall resistive layer. These additives are those which will form a polymer having a sufficiently high dissociation temperature to withstand the adverse effects of heat build-up at the interface. Suitable additives include graphite fluorides, fluorocarbon resins such as Teflon.RTM., and CeF.sub.4.


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