The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 1987
Filed:
Aug. 31, 1984
Applicant:
Inventors:
Takashi Murase, Yokohama, JP;
Tatsuya Koizumi, Tokyo, JP;
Assignees:
The Furukawa Electric Co., Ltd., Tokyo, JP;
Fuji Electric Co., Ltd., Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361385 ; 16510414 ; 174 / ; 357 82 ;
Abstract
A heat pipe heat sink for air cooling of semiconductor devices characterized by arranging heat pipes in a zigzag form toward the direction of air flow around the fin section in the heat sinks. A block for mounting the semiconductor device is fitted to the heat-in sections of the plural heat pipes arranged in parallel, and a large number of radiating fins crossing over the heat pipes are fitted to the heat-out sections of the heat pipes protruding from the block.