Signal ground planes for tape bonded devices

Abstract

A multiple layer tape bonding technique interconnects an integrated circuit chip having signal and ground bonding pads located thereon to other electrical devices. The tape bonding structure is comprised of a first layer having electrically isolated individual signal conductors coupled to respective ones of the signal bonding pads. The individual signal conductors extend away from the integrated circuit chip in an approximately parallel-spaced relationship to one another. An electrically insulating layer having a predefined thickness is deposited atop and adjacent the first layer. A ground plane layer overlies the insulating layer. The ground plane layer is comprised of a plurality of individual ground conductors coupled to respective individual ones of the ground bonding pads of the integrated circuit chip. The individual ground conductors overlie the insulating layer in a precisely spaced parallel relationship to the corresponding individual signal conductors. The individual ground conductors can be ieither electrically commoned, or electrically isolated to allow for individual tapering for impedance matching. The signal and grounding pads on the integrated circuit chip can be positioned relative to to each other in either a parallel aligned spaced relationship or in alternating and staggered spaced relationship to each other.