The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1987
Filed:
Oct. 04, 1985
Ryohei Satoh, Yokohama, JP;
Muneo Oshima, Yokohama, JP;
Minoru Tanaka, Yokohama, JP;
Suguru Sakaguchi, Chigasaki, JP;
Akira Murata, Tokyo, JP;
Kazuo Hirota, Chigasaki, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In connecting an electronic circuit part such as a semiconductor or other part to a substrate for mounting the part with solder, the solder is composed of a high-melting-point solder portion which is subjected to working such as rolling and heat treatment in order to break the cast structure thereof, and a smaller volume of low-melting-point solder portions. The high-melting-point solder portion is connected to both the electronic circuit substrate and the electronic circuit part through the low-point-melting solder portions. This method enables interconnection between objects to be connected without impairing the high ductility and toughness of the high-melting-point solder which is subjected to working and heat treatment. This soldering method ensures highly reliable manufacture of miniaturized high density circuits, such as LSI.