The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 1987

Filed:

Mar. 10, 1986
Applicant:
Inventors:

Katsukiyo Ishikawa, Kuze, JP;

Kanji Nishijima, Ibaraki, JP;

Mamoru Seio, Nishinomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F / ; B44C / ; C03C / ; C03C / ;
U.S. Cl.
CPC ...
1566591 ; 29852 ; 156656 ; 156666 ; 156902 ; 156904 ; 204 141 ; 427 97 ; 430313 ; 430318 ;
Abstract

The invention provides a method for preparing a printed circuit board with plated-through-holes, using a specifically prepared photoresist material and a combination of exposure, development and etching means. This method is particularly useful for the preparation of a printed circuit board with plated-through-holes bearing a high density circuit pattern.


Find Patent Forward Citations

Ishikawa, Katsukiyo. (1987). Method for preparing a printed circuit board (U.S. Patent No. 4673458). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4673458

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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