The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 1987

Filed:

Oct. 22, 1984
Applicant:
Inventor:

Michael E Dyer, Cleveland, TN (US);

Assignee:

Intera Corporation, Cleveland, TN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ;
U.S. Cl.
CPC ...
4284744 ; 4273934 ; 4273935 ; 4284758 ; 4284763 ; 428483 ; 428515 ; 428516 ; 428520 ;
Abstract

A process for improving the hygroscopic and soil release properties of a polymer substrate is provided in which the substrate is contacted with a suitable aqueous mixture containing a water soluble vinyl monomer and a hydrophobic vinyl monomer at a temperature of between about 40.degree. C. to 100.degree. C., and initiating polymerization of the water-soluble monomer by a chemical or physical initiator to form a vinyl polymer evenly disposed on the substrate. The hygroscopic and soil release properties of the substrate are thereby improved. The mixture may be in the form of an emulsion wherein the hydrophobic vinyl monomer is emulsified by an appropriate emulsifying agent. The invention also pertains to the improved substrates prepared in accordance with the present process.


Find Patent Forward Citations

Loading…