The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 1987

Filed:

Feb. 21, 1986
Applicant:
Inventors:

Michiyasu Komatsu, Yokohama, JP;

Tadashi Miyano, Sagamihara, JP;

Akio Ando, Kawasaki, JP;

Masae Nakanishi, Chigasaki, JP;

Yuuji Fujimoto, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B / ;
U.S. Cl.
CPC ...
264 63 ; 264 65 ; 501 97 ;
Abstract

A sintered ceramic body is manufactured first by preparing a composition containing a binder and a ceramic powder having a particle size distribution given such that 0 to 1 weight % of ceramic particles with a particle size of less than 0.2 .mu.m, 0 to 2 weight % of ceramic particles with a particle size of 0.2 .mu.m to less than 0.5 .mu.m, 5 to 15 weight % of ceramic particles with a particle size of 0.5 .mu.m to less than 1.0 .mu.m, 5 to 15 weight % of ceramic particles with a particle size of 1.0 .mu.m to less than 1.5 .mu.m, 5 to 15 weight % of ceramic particles with a particle size of 1.5 .mu.m to less than 2.0 .mu.m, and 50 to 80 weight % of ceramic particles with a particle size of not less than 2.0 .mu.m. The prepared composition is then injection-molded into a predetermined shape. The binder is removed from the molded body, and the binder-free molded body is sintered.


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