The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 1987
Filed:
Nov. 15, 1984
Koichi Nitta, Fukui, JP;
Kazuma Kabuta, Fukui, JP;
Masami Yamaguchi, Fukui, JP;
Tadahiro Nakagawa, Fukui, JP;
Katsuyuki Moriyasu, Kyoto, JP;
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Abstract
A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.