The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 1987
Filed:
Jun. 16, 1983
Hideo Suzuki, Katsuta, JP;
Satoshi Kokura, Hitachiohta, JP;
Osamu Asai, Hitachi, JP;
Kunio Miyazaki, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A metallized layer formed on a SiC sintered body essentially consists of a metal conductor such as Cu or Au as its principal component and a binder such as phosphorous alloy, the oxide of which forms a vitreous material together with a silicon oxide formed previously on the surface of the SiC sintered body, the metallized layer is bonded to the SiC sintered body through a fused vitreous layer of a composite oxide formed during sintering of the metallized layer in an oxidizing atmosphere, the fused vitreous layer of the composite oxide essentially consists of the silicon oxide and the oxides of the binder. The metallized layer exhibits an improved wettability to solders.