The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 1987
Filed:
Jan. 15, 1985
Takeshi Ninomiya, Chigasaki, JP;
Risuke Ozaki, Kokubunji, JP;
O. Key Printed Wiring Co., Ltd., Tokyo, JP;
Abstract
The present invention relates to a printed circuit board and to a method of manufacturing the same. The printed circuit board of the present invention consists of a metal board glued to a resin board which is provided with at least one circuit layer. The metal board is provided with holes which are filled with resin, and lead wire holes are provided at the centers of the resin filled holes. The resin board is provided with through holes. The center of the lead wire holes and the centers of the through holes are on identical lines. Further, the method of manufacturing a printed circuit board under the present invention is to provide resin holes on a metal board, filling the holes with resin, and providing lead wire holes at the centers of the resin filled holes. In this process, an identical hole position designating means is used for providing the resin holes and the lead wire holes. At least one circuit layer and through holes are to be provided on the resin board. Thereafter, the metal board and the resin board are glued together. In this process, the centers of the lead wire holes and the centers of the through holes are to be put on identical lines.