The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1987
Filed:
Sep. 23, 1983
Applicant:
Inventor:
Kazuo Nakamura, Yokohama, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
G01R / ;
U.S. Cl.
CPC ...
3241 / ; 3241 / ;
Abstract
A method of screening resin-sealed semiconductor devices having a resin body for sealing and a semiconductor chip is mounted on a die stage having a first and second bars, said first and second bars extending from said die stage to opposite side surfaces of the body and having a first and second ends exposed to said side surfaces, which method comprises the steps of applying electric voltage between said first and second ends to heat the semiconductor chip, and subjecting the device to screening test.
Nakamura, Kazuo. (1987). Method of screening resin-sealed semiconductor devices (U.S. Patent No. 4661771). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4661771
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile