The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 1987
Filed:
Oct. 31, 1984
Toshitada Onishi, Niiharu, JP;
Hiroshi Tateishi, Niiharu, JP;
Kenichi Koyama, Niiharu, JP;
Shigeo Saito, Osaka, JP;
Masayuki Nagata, Osaka, JP;
Agency of Industrial Science & Technology, Tokyo, JP;
Sumitomo Electric Indus, Ltd, Osaka, JP;
Abstract
A method for producing an aluminum-stabilized superconducting wire is dislcosed herein, which comprises alternately winding superconducting elementary wires and high purity wires around a core, such as an electrically insulated copper wire core, impregnating the entire wire arrangement with solder to bind the wires together and subsequently forming or drawing the wire arrangement to increase the adhesion between the wires. In another embodiment, the thus-impregnated wire arrangement is subjected to a heat treatment to recover the residual resistance ratio of the aluminum. The impregnated wire arrangement is characterized by having a high mechanical toughness and improved electrical contact for greater electrical stability.