The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 1987

Filed:

Dec. 23, 1985
Applicant:
Inventors:

Atsushi Kanda, Aichi, JP;

Shunichi Takagi, Aichi, JP;

Rokuro Kambe, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428627 ; 428641 ; 428660 ; 428661 ; 428663 ; 428671 ; 428672 ; 428673 ; 428670 ; 4272557 ; 4273833 ; 427404 ;
Abstract

The bond strength between a silicon carbide substrate and a metal layer comprised of a series of metal films is improved without detrimentally affecting other properties of such a device by interposing a layer of silicon, Si.sub.2 Mo or mixtures thereof between the substrate and the first metal film in the layer which is preferably Ti, Zr or Hf.


Find Patent Forward Citations

Kanda, Atsushi. (1987). Electronic component using a silicon carbide substrate and a method of (U.S. Patent No. 4657825). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4657825

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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