The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 1987
Filed:
Sep. 30, 1985
Applicant:
Inventor:
Herman F Nied, Clifton Park, NY (US);
Assignee:
General Electric Company, Schenectady, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428 64 ; 428192 ; 428901 ; 428902 ;
Abstract
A substrate for a semiconductor chip package comprises a metal layer characterized by a high coefficient of thermal conductivity and girded by a restraining wrapper characterized by both a low coefficient of thermal expansion and a high ultimate tensile strength.
Nied, Herman. (1987). Substrate for a semiconductor chip package and a method of fabricating (U.S. Patent No. 4657797). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4657797
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile