The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 1987
Filed:
Oct. 31, 1985
Jong S Lee, San Jose, CA (US);
American Microsystems, Inc., Santa Clara, CA (US);
Abstract
Desired control of the thickness and composition of a solder coat on the J-leads of an integrated circuit Quad package is obtained by orienting the packages while being solder coated in a 'leads-up' orientation as a series of strips mounting the packages are passed through a solder wave of a wave soldering apparatus on a pallet. The Quad or other shaped integrated circuit or other electronic packages which have leads extending exteriorly thereof, thus have the critical lead crest portions coated with substantially the same solder layer thickness and composition. This permits reliable electrical connections between the crest portions of the leads and printed circuit board metal traces (metallization), particularly in surface mounting of the package to a printed circuit board. An additional feature of the invention is a pallet for holding a series of package-holding elongate frames which pallet is used for conveying the packages through the wave soldering apparatus.