The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 1987
Filed:
Apr. 22, 1985
Shuji Ueda, Neyagawa, JP;
Kunio Nakada, Suita, JP;
Kazuhiko Fujino, Hirakata, JP;
Hiroshi Saeki, Neyagawa, JP;
Kenji Fujishiro, Hirakata, JP;
Matsushita Electric Industrial Co., Ltd., Kadoma, JP;
Abstract
A curved surface formation polishing apparatus for rotationally symmetrical objects such as optical lenses, mirrors, etc., which is so arranged that, by relatively displacing a processing tool and a workpiece in a direction generally intersecting at right angles with the rotary axis of the processing tool mounted on a rotating spindle so as to follow a predetermined curved surface cross section shape, grinding loci at a processing point of the workpiece formed by an abrasive grain cutting edge of the processing tool will overlap each other by crossing as the processing proceeds, thus achieving a favorable finished surface. Moreover, according to another embodiment of the present invention, more than two processing tools can be mounted on the same rotary axis, and there is provided a device for displacing the processing tools in the direction of the rotary axis so as to change-over the processing tools according to end uses and processing steps, so that change-over of the processing tools is facilitated, while it becomes possible to reduce deterioration in the accuracy of the processed shape by setting errors of the processing tools, with a simultaneous simplification of construction of the apparatus and reduction in cost for an improved mass-productivity.