The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 1987
Filed:
Jul. 18, 1985
Applicant:
Inventor:
Charles C Chen, Houston, TX (US);
Assignee:
Thomson Components-Mostek Corporation, Carrollton, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41F / ;
U.S. Cl.
CPC ...
101426 ; 101 35 ;
Abstract
A method for branding (labeling) a semiconductor chip package by warming the package prior to and subsequent to the branding resulting in a brand having greater clarity and permanency. A chip package is warmed to a temperature of about 95.degree. F. (35.degree. C.) to about 130.degree. F. (55.degree. C.) and an inked brand is applied to the warmed chip package. The branded chip package is maintained at a temperature of at least about 75.degree. F. (24.degree. C.) until the temperature is raised to a sufficient temperature to cure the branded chip package and then the branded chip package is cured.