The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 1987
Filed:
Dec. 16, 1985
Juzer Mohammed, Naperville, IL (US);
GTE Communication Systems Corporation, Northlake, IL (US);
Abstract
A printed wiring board with zones therein of controlled thermal coefficient of expansion including a first layer of first material, a second layer of second material and a third layer of a third material positioned between the first and the second layers. The third layer includes a first area whereat the material is removed and replaced with a control material possessing a thermal coefficient of expansion different from the first, second and third layers. The third layer and the control material each possess a first side bonded to a first side of the first layer and a second side bonded to a first side of a second layer to form the printed wiring board. Electronic components may be mounted on a second side of the first layer, the second layer, or both the first and second layers and the control material may be varied in composition and thickness to change thermal expansion in the zone above and below the control material. The control material may be thermally conductive and extend to a side of the board where it may contact a heat sinking board guide to provide a path for dissipating heat generated by the electronic components.